Realization of small and low profile Duplexer using a CSSD packaging technology

This paper presents the realization of Duplexer with small size, high reliability and excellent performance. Good heat radiation, hermetic performance and small frequency drift against temperature shift are essential to achieve small size and highly reliable Duplexers. In this paper, we will report on the advantage of the Chip Size SAW Devices (CSSD) structure for miniaturization and high reliability. In addition, we will discuss the possibility of further miniaturization.