author-photo

Robin A. Susko

IBM

4

Papers

21

Citations

Citation Trend

Filter By

Papers (4) Sort By

Journal Conference Others

Solder Bump Electromigration and CPI Challenges in Low-k Devices

2009
Show All
- Source
- Cite
- Save
Citations (7)
Resistance drift in aluminum to gold ultrasonic wire bonds

1991 ECTC | Electronic Components and Technology Conference
Show All
- Source
- Cite
- Save
Citations (14)
A method for modifying surfaces and application of this method for the production of layered structures.

1987
- Carol R. Jones
- Robin A. Susko
Show All
- Source
- Cite
- Save
Citations (0)
Procédé de modification des surfaces et application de ce procédé pour former des structures laminées

1987
- Carol R. Jones
- Robin A. Susko
Show All
- Source
- Cite
- Save
Citations (0)