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Takuma Hara
Takuma Hara
Toshiba
Electrical engineering
Logic gate
Engineering
Power MOSFET
Chip
3
Papers
13
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Stacked chip of Si power device with double side Cu plating for low on-resistance
2021
ISPSD | International Symposium on Power Semiconductor Devices and IC's
Tatsuya Ohguro
Hideharu Kojima
Takuma Hara
Tatsuya Nishiwaki
Shinichi Umekawa
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Cu Double Side Plating Technology for High Performance and Reliable Si Power Devices
2019
ISPSD | International Symposium on Power Semiconductor Devices and IC's
Hitoshi Kobayashi
Tatsuya Ohguro
Tetsuya Kai
Takako Motai
Masaaki Ogawa
Mie Matsuo
Kenichi Oohashi
Shinsuke Kozumi
Yoshiharu Takada
Hideharu Kojima
Shingo Masuko
Naoki Yonezawa
Akira Komatsu
Tatsuya Nishiwaki
Takuma Hara
Mari Takahashi
Akira Ezaki
Kenichi Ohtsuka
Seiji Inumiya
Kyoichi Suguro
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Design criteria for shoot-through elimination in Trench Field Plate Power MOSFET
2014
ISPSD | International Symposium on Power Semiconductor Devices and IC's
Tatsuya Nishiwaki
Takuma Hara
Keisuke Kaganoi
Makoto Yokota
Yoshitaka Hokomoto
Yusuke Kawaguchi
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Citations (12)
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