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Wen-Hao Lee

Siliconware Precision Industries Company, Ltd.

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Flux study for ultra fine pitch flip chip packages

2009 IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
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Underfill selection strategy for low k, high lead/lead-free flip chip application

2007 IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
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