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Jase Jiang
Jase Jiang
Siliconware Precision Industries Company, Ltd.
Electronic engineering
Materials science
Soldering
Flip chip
Delamination
5
Papers
12
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A comparison of polymers and solder alloys by reliability tests on multi-layer redistribution lines in Fan Out Wafer Level Package
2016
EPTC | Electronics Packaging Technology Conference
Hong-Da Chang
Jay Hsiao
Kenny Liu
H. S. Hsu
Andrew You
Carter Ding
Soriente Joshua Pagala
Tammy Zhu
Ivan Chang
James Jiang
Cheng-An Chang
Tommy Sun
George Pan
Nicholas Kao
Jase Jiang
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Flux study for ultra fine pitch flip chip packages
2009
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Wen-Hao Lee
G. T. Lin
David Chang
Jase Jiang
Carl Chen
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Underfill Assessments and Validations for Low-k FCBGA
2006
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Nicholas Kao
Jeng-Yuan Lai
Jase Jiang
Yu-Po Wang
cheng-Hsu Hsiao
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