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George F. Ouimet
George F. Ouimet
IBM
Engineering
Manufacturing engineering
Metal
Electronic engineering
Semiconductor device fabrication
3
Papers
9
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Hybrid clean approach for post-copper CMP defect reduction
2013
ASMC | Advanced Semiconductor Manufacturing Conference
Wei-Tsu Tseng
Vamsi Devarapalli
James J. Steffes
Adam Ticknor
Mahmoud Khojasteh
Praneetha Poloju
Colin Goyette
David Steber
Leo Tai
Steven E. Molis
Mary Zaitz
Elliott Rill
S. Mittal
Michael Kennett
Laertis Economikos
George F. Ouimet
Christine Bunke
Connie Truong
Stephan Grunow
Michael P. Chudzik
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Defect reduction and cost savings through re-inventing RCA cleans
1996
ASMC | Advanced Semiconductor Manufacturing Conference
George F. Ouimet
David L. Rath
Susan L. Cohen
Emily Fisch
Glenn W. Gale
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Improvements in process yields for a 200 mm wafer fabricator
1994
ASMC | Advanced Semiconductor Manufacturing Conference
George F. Ouimet
S. DeBlois
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