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Krutikesh Sahoo
Krutikesh Sahoo
University of California, Los Angeles
Materials science
Thermocompression bonding
Wafer
Embedded system
Computer science
4
Papers
1
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0
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I/O Architecture, Substrate Design, and Bonding Process for a Heterogeneous Dielet-Assembly based Waferscale Processor
2021
ECTC | Electronic Components and Technology Conference
Saptadeep Pal
Irina Alam
Krutikesh Sahoo
Haris Suhail
Rakesh Kumar
Sudhakar Pamarti
Puneet Gupta
Subramanian S. Iyer
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Co-optimizing signaling protocol with semiconductor and packaging technology
2021
EPEP | Electrical Performance of Electronic Packaging
Krutikesh Sahoo
Bapi Vinnakota
Shahab Ardalan
Subramanian S. Iyer
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Copper to gold thermal compression bonding in heterogenous wafer-scale systems
2021
ECTC | Electronic Components and Technology Conference
Krutikesh Sahoo
Saptadeep Pal
Niloofar Shakoorzadeh
Yu-Tao Yang
Subramanian S. Iyer
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Flexible Connectors and PCB Segmentation for Signaling and Power Delivery in Wafer-Scale Systems
2021
ECTC | Electronic Components and Technology Conference
Randall Irwin
Krutikesh Sahoo
Saptadeep Pal
Subramanian S. Iyer
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