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David M. Lee
David M. Lee
Johns Hopkins University
Materials science
Electronic engineering
Interconnection
Engineering
Wire bonding
5
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35
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Influence of Tin Deposition Methods on Tin Whisker Formation
2011
IEEE Transactions on Components, Packaging and Manufacturing Technology
Lesly A. Pinol
John Melngailis
Harry K. Charles
David M. Lee
Ryan M. Deacon
George L. Coles
Guy V. Clatterbaugh
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Grille de deblocage et procede de fabrication associe
2003
Harry K. Charles
Arthur S. Francomacaro
Allen C. Keeney
David M. Lee
Timothy J. Cornish
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Indium bump bonding for cryogenic applications
2001
Allen C. Keeney
David M. Lee
S. John Lehtonen
A. Shaun Francomacaro
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Wirebonding: reinventing the process for MCMs
1998
Journal of PeriAnesthesia Nursing
H.K.Jr. Charles
K.J. Mach
R.L. Edwards
S.J. Lehtonen
David M. Lee
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Wirebonding on various multichip module substrates and metallurgies
1997
ECTC | Electronic Components and Technology Conference
Harry K. Charles
K.J. Mach
R.L. Edwards
S.J. Lehtonen
David M. Lee
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Citations (11)
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