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Guy V. Clatterbaugh
Guy V. Clatterbaugh
Johns Hopkins University
Metallurgy
Engineering
Remote sensing
Physics
Fabrication
5
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102
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Influence of Tin Deposition Methods on Tin Whisker Formation
2011
IEEE Transactions on Components, Packaging and Manufacturing Technology
Lesly A. Pinol
John Melngailis
Harry K. Charles
David M. Lee
Ryan M. Deacon
George L. Coles
Guy V. Clatterbaugh
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Reliable miniature electronic and optical interconnects for low-volume applications
2008
Johns Hopkins Apl Technical Digest
Guy V. Clatterbaugh
Charles V. Banda
S. John Lehtonen
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SOME KEY ISSUES IN MICROELECTRONIC PACKAGING
1999
Johns Hopkins Apl Technical Digest
Guy V. Clatterbaugh
Paul Vichot
Harry K. Charles
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The effect of high-temperature intermetallic growth on ball shear-induced cratering
1989
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Guy V. Clatterbaugh
Harry K. Charles
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Citations (31)
Gold-Aluminum Intermetallics: Ball Bond Shear Testing and Thin Film Reaction Couples
1984
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Guy V. Clatterbaugh
Joel A. Weiner
Harry K. Charles
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Citations (57)
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