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Seiichiro Nakao
Seiichiro Nakao
Konan University
Materials science
Metallurgy
Inorganic chemistry
Reducing agent
Copper plating
9
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16
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無電解めっきの触媒付与のための前処理液、該液を使用する前処理方法、該方法を使用して製造した無電解めっき皮膜及び(又は)めっき被覆体
2002
Touken Kin
Shingo Kitamura
Seiichiro Nakao
Hidemi Nawafune
Keigo Obata
Yoshiaki Okuhama
Hidenori Tsuji
Masakazu Yoshimoto
seiitirou nakao
singo kitamura
masaiti yosimoto
yosiaki okuhama
keigo obata
hidemi nawa fune
hidenori tuzi
higasi satosi kin
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Fabrication of Ultra-large Scale Integrated by Electroless Neutral Copper Plating
1999
Journal of The Surface Finishing Society of Japan
Hidemi Nawafune
Seiichiro Nakao
Shozo Mizumoto
Yosiki Murakami
Sin Hasimoto
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Deposition Mechanism of Electroless Pd Plating Using Formic Acid as a Reducing Agent
1999
Journal of The Surface Finishing Society of Japan
Ei Uchida
Takashi Okada
Hidemi Nawafune
Seiichiro Nakao
Shozo Mizumoto
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Electroless Palladium Plating from Monoaminodicarboxylic Acid Complex Bath Using Formic Acid as a Reducing Agent
1998
Journal of The Surface Finishing Society of Japan
Hidemi Nawafune
Seiichiro Nakao
Shozo Mizumoto
Ei Uchida
Takashi Okada
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Electroless palladium plating from ethylenediamine complex bath using formic acid as a reducing agent
1997
Journal of The Surface Finishing Society of Japan
Hidemi Nawafune
Seiichiro Nakao
Shozo Mizumoto
Ei Uchida
Takashi Okada
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Citations (4)
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