Electroless palladium plating from ethylenediamine complex bath using formic acid as a reducing agent

Hidemi Nawafune,Seiichiro Nakao,Shozo Mizumoto,Ei Uchida,Takashi Okada

Electroless palladium plating from ethylenediamine complex bath using formic acid as a reducing agent

1997

Hidemi Nawafune
Seiichiro Nakao
Shozo Mizumoto
Ei Uchida
Takashi Okada

We discuss plating conditions on electroless pure palladium plating from palladium-ethylenediamine complex baths and evaluate the adptability of this technique to different electronic parts

Keywords:

Reducing agent
Solderability
Metallurgy
Inorganic chemistry
Palladium
Ethylenediamine
Materials science
Formic acid
electroless deposition
deposition rate
chemical deposition

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