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Jan Höfer
Jan Höfer
Fraunhofer Society
Electronic engineering
Wire bonding
Engineering
Composite material
Aluminium
4
Papers
25
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Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz
2018
IEEE Transactions on Components, Packaging and Manufacturing Technology
Brian Curran
Jacob Reyes
Christian Tschoban
Jan Höfer
Arian Grams
Felix Wust
Matthias Hutter
Jens Leib
Marta Martinez-Vazquez
Rens Baggen
Ivan Ndip
Klaus-Dieter Lang
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Citations (6)
Microstructural evolution of ultrasonic-bonded aluminum wires
2015
Microelectronics Reliability
Marian Sebastian Broll
Ute Geissler
Jan Höfer
Stefan Schmitz
Olaf Wittler
K.-D. Lang
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Citations (12)
Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding
2015
Microelectronics Reliability
Marian Sebastian Broll
Ute Geissler
Jan Höfer
Stefan Schmitz
Olaf Wittler
Martin Schneider-Ramelow
Klaus-Dieter Lang
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Citations (3)
A geometry-independent lifetime modelling method for aluminum heavy wire bond joints
2015
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Arian Grams
Jan Höfer
Andreas Middendorf
Stefan Schmitz
Olaf Wittler
Klaus-Dieter Lang
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Citations (4)
1