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Stefan Kaessner
Stefan Kaessner
Bosch
Materials science
Power electronics
Encapsulation (computer programming)
Ceramic
Electronics
5
Papers
12
Citations
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Simulative Comparison of Polymer and Ceramic Encapsulation on SiC-MOSFET Power Modules under Thermomechanical Load
2019
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Felix Wagner
Youssef Maniar
Martin Rittner
Stefan Kaessner
Michael Guyenot
Lukas Lang
Bernhard Wunderle
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Hydration of calcium aluminates at 60°C – Development paths of C2AHx in dependence on the content of free water
2019
Journal of the American Ceramic Society
Florian Hueller
Juergen Neubauer
Stefan Kaessner
F. Goetz-Neunhoeffer
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Implementation of a new thermal path within the structure of inorganic encapsulated power modules
2019
Microelectronics Reliability
S. Behrendt
R. Eiselé
M. G. Scheibel
Stefan Kaessner
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Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density
2018
ECTC | Electronic Components and Technology Conference
Bianca Boettge
Falk Naumann
S. Behrendt
M. G. Scheibel
Stefan Kaessner
Sandy Klengel
Matthias Petzold
Klaus G. Nickel
G. Hejtmann
A.Z. Miric
R. Eiselé
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Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging
2018
Journal of microelectronics and electronic packaging
Stefan Kaessner
Markus G. Scheibel
Stefan Behrendt
Bianca Boettge
Christoph Berthold
Klaus G. Nickel
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Citations (2)
1