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M. G. Scheibel
M. G. Scheibel
Electronic engineering
Power density
Power module
Materials science
Power semiconductor device
2
Papers
5
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0
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Implementation of a new thermal path within the structure of inorganic encapsulated power modules
2019
Microelectronics Reliability
S. Behrendt
R. Eiselé
M. G. Scheibel
Stefan Kaessner
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Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density
2018
ECTC | Electronic Components and Technology Conference
Bianca Boettge
Falk Naumann
S. Behrendt
M. G. Scheibel
Stefan Kaessner
Sandy Klengel
Matthias Petzold
Klaus G. Nickel
G. Hejtmann
A.Z. Miric
R. Eiselé
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Citations (5)
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