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Huiming Pan
Huiming Pan
Wuhan University
Materials science
Soldering
Composite material
Electronic packaging
Finite element method
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Analysis on the Thermal Stress of Al-Si Thin Film using DIC Method
2021
ICEPT | International Conference on Electronic Packaging Technology
Huiming Pan
Guoliang Xu
Zhiwen Chen
Chongming Zhang
Chao Sun
Sheng Liu
Li Liu
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Mechanical Performance and Reliability of a Sn–Ag–Cu–Sb Alloy at Elevated Temperatures
2021
IEEE Transactions on Components, Packaging and Manufacturing Technology
Zhiwen Chen
Kun Ma
Li Liu
N.-C. Lee
Guoyou Liu
Jiasheng Yan
Hui Li
Sheng Liu
Meng Ruan
Huiming Pan
Lu Wenli
Jiaqi Ding
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Design and optimization of a pneumatic DOD solder ball 3D printing system
2021
ICEPT | International Conference on Electronic Packaging Technology
Zhixian Min
Huiming Pan
Dinglei Zhao
Sheng Liu
Zhiqin Wang
Zhiwen Chen
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