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R. D. Wang
R. D. Wang
TSMC
Electronic engineering
Engineering
Integrated circuit
Mechanical engineering
Chip
4
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24
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Micro bump height derivation control with dynamic sizing patterning
2018
ASMC | Advanced Semiconductor Manufacturing Conference
Chen-Hsun Liu
J. H. Chen
Yu-Nu Hsu
M.H. Tsai
C.C. Hung
R. D. Wang
C. S. Liu
T. H. Pan
Chih-Hsing Chen
K. C. Liu
Harry Ku
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Laser grooving profile optimization for chip strength enhancement
2017
MIPRO | International Convention on Information and Communication Technology, Electronics and Microelectronics
P.S. Tsai
J. H. Chen
R. D. Wang
C. S. Liu
Harry Ku
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Yield and reliability of 3DIC technology for advanced 28nm node and beyond
2011
VLSIT | Symposium on VLSI Technology
Kuo-Nan Yang
Tsang-Jiuh Wu
Wen-Chih Chiou
M.F. Chen
Yen-Liang Lin
F.W. Tsai
Cheng-Hsiang Hsieh
Chih-Sheng Chang
Wei Cheng Wu
Yen-Huei Chen
T.Y. Chen
H.R. Wang
I.C. Lin
S. B. Jan
R. D. Wang
Y.J. Lu
Y.C. Shih
H.A. Teng
C.S. Tsai
M.N. Chang
Kim Hong Chen
Shang-Yun Hou
S.P. Jeng
Chen-Hua Yu
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Citations (7)
Electromigration study of micro bumps at Si/Si interface in 3DIC package for 28nm technology and beyond
2011
ECTC | Electronic Components and Technology Conference
Tsung-Shu Lin
R. D. Wang
M.F. Chen
Christine Chiu
S. Y. Chen
Tung-Chin Yeh
Larry C. Lin
Shang-Yun Hou
J. C. Lin
K.h. Chen
Shin-puu Jeng
Douglas Yu
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Citations (16)
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