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Chen-Hsun Liu
Chen-Hsun Liu
TSMC
Soldering
Composite material
Engineering
Electronic engineering
Flip chip
3
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Micro bump height derivation control with dynamic sizing patterning
2018
ASMC | Advanced Semiconductor Manufacturing Conference
Chen-Hsun Liu
J. H. Chen
Yu-Nu Hsu
M.H. Tsai
C.C. Hung
R. D. Wang
C. S. Liu
T. H. Pan
Chih-Hsing Chen
K. C. Liu
Harry Ku
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Conducting external connector structure and processes for their preparation
2016
Meng-fu Shih
Chun-Yen Lo
Cheng-Lin Huang
Chien-ming Huang
Yuan-fu Liu
Wei-chih Huang
Yu-Nu Hsu
Chi-hung Lin
Te-hsun Pang
Wen-ming Chen
Yung-chiuan Cheng
Chen-Hsun Liu
Chien-pin Chan
Chin-Yu Ku
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Cu/Ni interface study for bump reliability improvement
2013
ASMC | Advanced Semiconductor Manufacturing Conference
Rung-De Wang
Chen-Hsun Liu
Yu-Nu Hsu
Justin Lo
Chin-Yu Ku
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