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Andrey Grinman
Andrey Grinman
Wafer-level packaging
Image sensor
Electronic engineering
Wafer
Embedded Wafer Level Ball Grid Array
3
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300mm Wafer-Level Image Sensor Packaging
2011
Thorsten Matthias
Bioh Kim
Gerald Mittendorfer
Paul Lindner
Moshe Kriman
Andrey Grinman
Alex Feldman
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300mm Scaling of Critical Silicon Etches for Image Sensor Wafer-Level Packaging Based on Tessera's MVP (TSV) Technology
2011
Dave Thomas
Matthew Muggeridge
Mike Steel
Dorleta Cortaberria Sanz
Hefin Griffiths
Oliver Ansell
Moshe Kriman
Andrey Grinman
Hagit Gershtenman-Avsian
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Ensembles empilés utilisant des tranches reconstituées
2008
Osher Avsian
Andrey Grinman
Giles Humpston
Moti Margalit
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