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Moshe Kriman
Moshe Kriman
Wafer-level packaging
Image sensor
Electronic engineering
Wafer
Art
7
Papers
9
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300mm Scaling of Critical Silicon Etches for Image Sensor Wafer-Level Packaging Based on Tessera's MVP (TSV) Technology
2011
Dave Thomas
Matthew Muggeridge
Mike Steel
Dorleta Cortaberria Sanz
Hefin Griffiths
Oliver Ansell
Moshe Kriman
Andrey Grinman
Hagit Gershtenman-Avsian
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Wafer Level Camera technology - from wafer level packaging to wafer level integration
2010
ICEPT | International Conference on Electronic Packaging Technology
Hongtao Han
Moshe Kriman
Mark Boomgarden
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Stapelung von kapselungen auf chipmassstab auf waferebene mit randkontakten
2009
Belgacem Haba
Ilyas Mohammed
Laura Mirkarimi
Moshe Kriman
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Module multicouche empile et procedes de connexion laterale et de fabrication
2002
Moshe Kriman
Boris Yofis
Yaakov Gridish
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