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Antoine Nowodzinski
Antoine Nowodzinski
Wafer-level packaging
Engineering
Electrical resistance and conductance
Electronic engineering
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Reliability tests on micro-insert die bonding technology
2012
CAS | International Semiconductor Conference
Antoine Nowodzinski
Hervé Boutry
Rémy Franiatte
Vincent Mandrillon
Romain Anciant
Sophie Verrun
Gilles Simon
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