Reliability tests on micro-insert die bonding technology

Micro-insert technology is a wafer level stacking technology offering main advantages such as simplicity, low cost and compatibility with chip assembly technologies. This paper presents recent preliminary reliability tests results. Thermal cycling tests between −40°C and 125°C and damp heat tests at 85%RH/85°C are performed, tests results show that micro-insert technology is very robust. A interesting correlation is found between initial interconnection electrical resistance and time to failure during damp heat test, allowing die sorting for reliability.