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S. Guggilla
S. Guggilla
Applied Materials
Materials science
Dielectric
Analytical chemistry
Copper interconnect
Physical vapor deposition
5
Papers
17
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New generation of reactive pre-clean prior to barrier-seed deposition to preserve ULK integrity
2012
Microelectronic Engineering
M. Delavant
J. Guillan
D. Galpin
Sonarith Chhun
M. Juhel
Denis Guiheux
P. Jian
T.H. Ha
John C. Forster
S. Guggilla
S. Hong
B. Bozon
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Citations (2)
Barrier reliability of ALD TaN on sub-100 nm copper low-k interconnects
2005
Zsolt Tokei
Thomas Gailledrat
Yunlong Li
Jörg Schuhmacher
Tushar Mandrekar
S. Guggilla
Bencherki Mebarki
Karen Maex
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Citations (1)
Reliability studies of MOCVD TiSiN and EnCoRe Ta(N)/Ta
2003
Microelectronic Engineering
Zs. Tőkei
D. Kelleher
Bencherki Mebarki
Tushar Mandrekar
S. Guggilla
Karen Maex
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Citations (2)
Barrier studies on porous silk semiconductor dielectric
2003
Microelectronic Engineering
Zs. Tőkei
Francesca Iacopi
O. Richard
J. Waeterloos
Steve Rozeveld
E. Beach
Bencherki Mebarki
Tushar Mandrekar
S. Guggilla
Karen Maex
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Citations (12)
Copper seed layer scaling for advanced interconnects: extendibility of I-PVD
2002
Zsolt Tokei
Steven Demuynck
Iwan Vervoort
Bencherki Mebarki
Tushar Mandrekar
S. Guggilla
Karen Maex
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