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P. Thompson
P. Thompson
Texas Instruments
Composite material
Thermal
Engineering
Metallurgy
Soldering
2
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2
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0
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Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints
2020
ECTC | Electronic Components and Technology Conference
S. Thekkut
R Das
M. Njuki
J. Li
Rajesh Sharma Sivasubramony
F. W. Alshatnawi
M. Moise
Christopher M. Greene
N. G. Dimitrov
Peter Borgesen
N. Shahane
P. Thompson
K. Mirpuri
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Diffusion Creep of Realistic SnAgCu Solder Joints at Times and Stresses of Relevance to Thermal Fatigue
2019
IEEE Transactions on Components, Packaging and Manufacturing Technology
T. Alghoul
L. Wentlent
Rajesh Sharma Sivasubramony
Christopher M. Greene
P. Thompson
Peter Borgesen
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