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S. Thekkut
S. Thekkut
Binghamton University
Composite material
Materials science
Aerosol
Substrate (chemistry)
Amplitude
4
Papers
3
Citations
0
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2024
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Aging and Fatigue of Aerosol Jet-Printed Nano-Ag Traces on Flexible Substrate
2021
Journal of Electronic Packaging
Arun Raj
Rajesh Sharma Sivasubramony
Manu Yadav
S. Thekkut
Gurvinder Singh Khinda
Mohammed Alhendi
Mark D. Poliks
Peter Borgesen
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Citations (2)
Damage Accumulation in Printed Interconnects on Flex Under Combinations of Bending and Tension with Different Amplitudes
2020
ECTC | Electronic Components and Technology Conference
Rajesh Sharma Sivasubramony
Mohammed Alhendi
M.Z. Kokash
Manu Yadav
Arun Raj
S. Thekkut
E Enakerakpo
Nardeeka Adams
Peter Borgesen
Mark D. Poliks
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Citations (1)
Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints
2020
ECTC | Electronic Components and Technology Conference
S. Thekkut
R Das
M. Njuki
J. Li
Rajesh Sharma Sivasubramony
F. W. Alshatnawi
M. Moise
Christopher M. Greene
N. G. Dimitrov
Peter Borgesen
N. Shahane
P. Thompson
K. Mirpuri
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Aging and Fatigue of Aerosol Jet Printed Nano-Ag Traces on Flexible Substrate
2020
Journal of Electronic Packaging
Arun Raj
Rajesh Sharma Sivasubramony
Manu Yadav
S. Thekkut
Gurvinder Singh Khinda
Mohammed Alhendi
Mark D. Poliks
Peter Borgesen
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Citations (0)
1