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Johnny Han He
Johnny Han He
Agency for Science, Technology and Research
Electronic engineering
Microelectromechanical systems
Materials science
Wafer-level packaging
Wafer bonding
4
Papers
385
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Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging
2009
Sensors and Actuators A-physical
Chengkuo Lee
Aibin Yu
Liling Yan
Haitao Wang
Johnny Han He
Q. X. Zhang
John H. Lau
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Citations (33)
Electromagnetic energy harvesting from vibrations of multiple frequencies
2009
Journal of Micromechanics and Microengineering
Bin Yang
Chengkuo Lee
Wenfeng Xiang
Jin Xie
Johnny Han He
Rama Krishna Kotlanka
Siew Ping Low
Hanhua Feng
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Citations (290)
Theoretical comparison of the energy harvesting capability among various electrostatic mechanisms from structure aspect
2009
Sensors and Actuators A-physical
Chengkuo Lee
Ye Mei Lim
Bin Yang
Rama Krishna Kotlanka
Chun-Huat Heng
Johnny Han He
Min Tang
Jin Xie
Hanhua Feng
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Citations (51)
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