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Aibin Yu

Agency for Science, Technology and Research

40

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A low-profile three-dimensional neural probe array using a silicon lead transfer structure

2013 Journal of Micromechanics and Microengineering
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Development of 25- $\mu{\rm m}$ -Pitch Microbumps for 3-D Chip Stacking

2012 IEEE Transactions on Components, Packaging and Manufacturing Technology
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On-chip optical power measurement by optical force

2011 TRANSDUCERS | International Conference on Solid-State Sensors, Actuators and Microsystems
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A broadband 3D package for RF MEMS devices utilizing through silicon vias (TSV)

2011 TRANSDUCERS | International Conference on Solid-State Sensors, Actuators and Microsystems
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Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

2011 IEEE Transactions on Components, Packaging and Manufacturing Technology
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MEMS micromirror integrated endoscopic probe for optical coherence tomography bioimaging

2011 Sensors and Actuators A-physical
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A micromachined injection-locked laser via tunable grating mirror

2010 OFC | Optical Fiber Communication Conference
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Wideband transitions for wafer level MEMS packages

2010 EDAPS | Electrical Design of Advanced Packaging and Systems Symposium
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Microfabricated endoscopic probe integrated MEMS micromirror for optical coherence tomography bioimaging

2010 EMBC | International Conference of the IEEE Engineering in Medicine and Biology Society
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A 3mm endoscopic probe with integrated MEMS micromirror for optical coherence tomography bioimaging

2010 Procedia Engineering
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