Old Web
English
Sign In
Acemap
>
authorDetail
>
Pierre Bondue
Pierre Bondue
University of Bordeaux
Intermetallic
Engineering
Microstructure
Soldering
Metallurgy
2
Papers
6
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (2)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
L'effet de la température et de la tension sur des vieillissements HTRB et HTGB pour des HEMTs GaN de puissance
2018
Omar Chihani
Loïc Théolier
Alain Bensoussan
Pierre Bondue
Jean-Yves Delétage
André Durier
Eric Woirgard
Show All
Source
Cite
Save
Citations (0)
High temperature ageing of microelectronics assemblies with SAC solder joints
2017
Microelectronics Reliability
Wissam Sabbah
Pierre Bondue
Oriol Avino-Salvado
Cyril Buttay
Hélène Fremont
Alexandrine Guédon-Gracia
Hervé Morel
Show All
Source
Cite
Save
Citations (6)
1