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Hamid R. Azimi
Hamid R. Azimi
Engineering
Electronic engineering
Delamination
Composite material
Integrated circuit packaging
4
Papers
66
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Flip chip pin grid array (FC-PGA) packaging technology
2000
EPTC | Electronics Packaging Technology Conference
Hwai Peng Yeoh
Mirng-Ji Lii
B. Sankman
Hamid R. Azimi
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Reliability of high aspect ratio plated through holes (PTH) for advanced printed circuit board (PCB) packages
1997
IRPS | International Reliability Physics Symposium
D. Goval
Hamid R. Azimi
Kim Poh Chong
Mirng-Ji Lii
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Citations (18)
Adhesion issued in epoxy-based chip attach adhesives
1997
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
Raymond A. Pearson
Thomas B. Lloyd
Hamid R. Azimi
Jen-Chou Hsiung
Malcolm S. Early
Peter D. Brandenburger
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Citations (10)
Fatigue crack propagation along polymer-metal interfaces in microelectronic packages
1997
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
John S. Guzek
Hamid R. Azimi
S. Suresh
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Citations (31)
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