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Peter D. Brandenburger
Peter D. Brandenburger
Adhesive
Electronic engineering
Engineering
Fracture mechanics
Epoxy
1
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10
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Adhesion issued in epoxy-based chip attach adhesives
1997
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
Raymond A. Pearson
Thomas B. Lloyd
Hamid R. Azimi
Jen-Chou Hsiung
Malcolm S. Early
Peter D. Brandenburger
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Citations (10)
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