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H. J. Woo
H. J. Woo
Samsung
Composite material
Materials science
Copper
Surface finishing
Soldering
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Effect of Ni Surface Finish on Half Etched Cu on Solder Joint Reliability
2007
ECTC | Electronic Components and Technology Conference
S. W. Shin
Pyoung-Wan Kim
H. J. Woo
Eun-Chul Ahn
I. S. Cho
T.G. Chung
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