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Robin Mair
Robin Mair
Metrology
Materials science
Optoelectronics
Picosecond
Picosecond ultrasonics
6
Papers
2
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0
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Monitoring critical process steps in 3D nand and advanced RF using picosecond ultrasonic metrology
2018
CSTIC | China Semiconductor Technology International Conference
Johnny Dai
Robin Mair
KwanSoon Park
Xinglin Zeng
Priya Mukundhan
Cheolkyu Kim
Tim Kryman
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Enhancements to Picosecond Acoustic Metrology for application in FO-WLP Process
2018
Manjusha Mehendale
Robin Mair
J. Chen
J Tan
J. Dai
Priya Mukundhan
C. Kim
Timothy Kryman
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Non-destructive acoustic metrology and void detection in 3×50μm TSV
2016
ASMC | Advanced Semiconductor Manufacturing Conference
Robin Mair
Michael Kotelyanskii
Manjusha Mehendale
Xueping Ru
Priya Mukundhan
Timothy Kryman
M. Liebens
S. Van Huylenbroeck
L. Haensel
Andy Miller
Eric Beyne
Todd W. Murray
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A New In-line Laser-based Acoustic Technique for Pillar Bump Metrology
2015
Journal of microelectronics and electronic packaging
Todd W. Murray
Andrew Bakir
David M. Stobbe
Michael Kotelyanskii
Robin Mair
Manjusha Mehendale
Xueping Ru
Jonathan D. Cohen
Michelle T. Schulberg
Priya Mukundhan
Timothy Kryman
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Non-Destructive Acoustic Metrology for Void Detection in Tsv's
2014
Advanced Semiconductor Manufacturing Conference
Manjusha Mehendale
Robin Mair
Michael Kotelyanskii
Todd W. Murray
Jacob D. Dove
Xueping Ru
Jonathan D. Cohen
Priya Mukundhan
Timothy Kryman
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