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Chao-Hsien Peng
Chao-Hsien Peng
TSMC
Microstructure
Sputtering
Sputter deposition
Inorganic chemistry
Crystallite
4
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14
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Cu/低K配線のための低による抵抗性と低コストPVD TiZrN障壁【Powered by NICT】
2016
Yu-Chen Chan
Chao-Hsien Peng
Ming-Han Lee
Shin-Yi Yang
Ching-Fu Yeh
Shau-Lin Shue
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Low-via-resistance and low-cost PVD-TiZrN barrier for Cu/low-K interconnects
2016
IITC | International Interconnect Technology Conference
Yu-Chen Chan
Chao-Hsien Peng
Ming-Han Lee
Shin-Yi Yang
Ching-Fu Yeh
Shau-Lin Shue
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Growth of (Ti,Zr)N Films on Si by DC Reactive Sputtering of TiZr in N 2 / Ar Gas Mixtures Effect of Flow Ratio
2004
Journal of The Electrochemical Society
Yu-Lin Kuo
Chiapyng Lee
Jing-Cheng Lin
Chao-Hsien Peng
Li-Chien Chen
Ching-Hua Hsieh
Shau-Lin Shue
Mong-Song Liang
Brian J. Daniels
Cheng-Lin Huang
Chih-Huang Lai
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Characteristics of DC Reactively Sputtered (Ti,Zr)N Thin Films as Diffusion Barriers for Cu Metallization
2003
Electrochemical and Solid State Letters
Yu-Lin Kuo
Chiapyng Lee
Jing-Cheng Lin
Chao-Hsien Peng
Li-Chien Chen
Ching-Hua Hsieh
Shau-Lin Shue
Mong-Song Liang
Brian J. Daniels
Cheng-Lin Huang
Chih-Huang Lai
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Citations (7)
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