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Maud Samson
Maud Samson
IBM
Wetting
Flip chip
Materials science
Electronic engineering
Soldering
3
Papers
16
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Fluxless Chip Join Process Using Formic Acid Atmosphere in a Continuous Mass Reflow Furnace
2016
ECTC | Electronic Components and Technology Conference
Maud Samson
Valerie Oberson
Isabelle Paquin
Clement J. Fortin
Jean-Claude Raymond
Charles Bureau
Michael Barnes
Xike Zhao
David Wright
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Citations (10)
Modeling the Flip-Chip Wetting Process
2014
IEEE Transactions on Components, Packaging and Manufacturing Technology
Julien Sylvestre
Maud Samson
Dominique Langlois Demers
Eric Duchesne
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Citations (5)
Large-Scale Model of Flip-Chip Joining Defects
2014
Julien Sylvestre
Maud Samson
Eric Duchesne
Dominique Langlois Demers
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Citations (1)
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