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Isabelle Paquin
Isabelle Paquin
IBM
Chip
Flip chip
Composite material
Materials science
Void (astronomy)
3
Papers
12
Citations
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Fluxless Chip Join Process Using Formic Acid Atmosphere in a Continuous Mass Reflow Furnace
2016
ECTC | Electronic Components and Technology Conference
Maud Samson
Valerie Oberson
Isabelle Paquin
Clement J. Fortin
Jean-Claude Raymond
Charles Bureau
Michael Barnes
Xike Zhao
David Wright
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Citations (10)
Study of influential parameters for lead-free flip chip solder joint cracking
2013
EMPC | European Microelectronics and Packaging Conference
A. Ayari-Kanoun
Valerie Oberson
Isabelle Paquin
Clement J. Fortin
R. Fontaine
David Danovitch
Dominique Drouin
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Citations (1)
Study of influential parameters for lead-free flip chip solder joint cracking
2013
EMPC | European Microelectronics and Packaging Conference
Asma Ayari-Kanoun
Valerie Oberson
Isabelle Paquin
Clement J. Fortin
R. Fontaine
David Danovitch
Dominique Drouin
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Citations (1)
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