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Rimon Ikeno

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COOL interconnect low power interconnection technology for scalable 3D LSI design

2011
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A 1.5V, 200 MHz, 400 MIPS, 188 muA/MHz and 1.2V, 300 MHz, 600 MIPS, 169 muA/MHz Digital Signal Processor Core for 3G Wireless Applications

2004 IEICE Transactions on Electronics
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