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Marie-Emmanuelle Faivre
Marie-Emmanuelle Faivre
Wafer dicing
Materials science
Wafer-level packaging
Electronic engineering
Die (integrated circuit)
2
Papers
4
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直径10nmナノワイヤCMOSにおけるキャリア輸送に関する研究(IEDM特集(先端CMOSデバイス・プロセス技術))
2011
SDM | SIAM International Conference on Data Mining
kiiti kan
Mikael Casse
S. Barraud
C. Dupré
A. Hubert
N. Vulliet
Marie-Emmanuelle Faivre
C. Vizioz
C. Carabasse
V. Delaye
Jean-Michel Hartmann
hirosi iwai
S. Cristoloveanu
O. Faynot
Thomas Ernst
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Chip In Wafer for Integrated System
2008
EPTC | Electronics Packaging Technology Conference
Jean-Charles Souriau
Marie-Emmanuelle Faivre
Nicolas Sillon
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Citations (4)
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