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Da Song
Da Song
IBM
Anodic bonding
Electronic engineering
Materials science
Dielectric
Wire bonding
2
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11
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0
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Copper-to-dielectric heterogeneous bonding for 3D integration
2014
Wei Lin
Juntao Li
Joseph Washington
David L. Rath
Spyridon Skordas
Toshiaki Kirihata
Kevin R. Winstel
B. Peethala
J. Demarest
Da Song
Daniel C. Edelstein
Subramanian S. Iyer
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Wafer-scale oxide fusion bonding and wafer thinning development for 3D systems integration: Oxide fusion wafer bonding and wafer thinning development for TSV-last integration
2012
Spyridon Skordas
D.C. La Tulipe
Kevin R. Winstel
Tuan Vo
Deepika Priyadarshini
A. Upham
Da Song
Alex Hubbard
R. Johnson
Kristian Cauffman
Sivananda K. Kanakasabapathy
Wei Lin
Seth L. Knupp
M. Malley
Mukta G. Farooq
Robert Hannon
Daniel George Berger
S. S. Iyer
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Citations (10)
1