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Naruhiko Nishiwaki
Naruhiko Nishiwaki
NHK Spring Company
Particle
Composite material
Materials science
Shear strength
Microstructure
4
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24
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Low temperature bonding with high shear strength using micro-sized Ag particle paste for power electronic packaging
2018
Journal of Materials Science: Materials in Electronics
Myong-Hoon Roh
Hiroshi Nishikawa
Seiichiro Tsutsumi
Naruhiko Nishiwaki
Keiichi Ito
Koji Ishikawa
Akihiro Katsuya
Nobuo Kamada
Mutsuo Saito
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Citations (5)
Effect of temperature and substrate on shear strength of the joints formed by sintering of micro-sized Ag particle paste without pressure
2017
Journal of Materials Science: Materials in Electronics
Myong-Hoon Roh
Hiroshi Nishikawa
Seiichiro Tsutsumi
Naruhiko Nishiwaki
Keiichi Ito
Koji Ishikawa
Akihiro Katsuya
Nobuo Kamada
Mutsuo Saito
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Citations (6)
Bonding process without pressure using a chestnut-burr-like particle paste for power electronics
2016
ICEP | International Conference on Electronics Packaging
Myong-Hoon Roh
Hiroshi Nishikawa
Seiichiro Tsutsumi
Naruhiko Nishiwaki
Keiichi Ito
Koji Ishikawa
Akihiro Katsuya
Nobuo Kamada
Mutsuo Saito
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Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging
2016
Materials Transactions
Myong-Hoon Roh
Hiroshi Nishikawa
Seiichiro Tsutsumi
Naruhiko Nishiwaki
Keiichi Ito
Koji Ishikawa
Akihiro Katsuya
Nobuo Kamada
Mutsuo Saito
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Citations (13)
1