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Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging
Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging
2016
Myong-Hoon Roh
Hiroshi Nishikawa
Seiichiro Tsutsumi
Naruhiko Nishiwaki
Keiichi Ito
Koji Ishikawa
Akihiro Katsuya
Nobuo Kamada
Mutsuo Saito
Keywords:
Particle
Microstructure
Composite material
Metallurgy
Electronic packaging
Materials science
Shear strength
Correction
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