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Calvin Chua Hung Ming
Calvin Chua Hung Ming
Agency for Science, Technology and Research
Electronic engineering
Materials science
Wafer
Three-dimensional integrated circuit
Mechanical engineering
2
Papers
5
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0
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Wafer Level Reliability Characterization of 2.5D IC packages
2018
EPTC | Electronics Packaging Technology Conference
Jayasanker Jayabalan
Jong Ming Chinq
Vivek Chidambaram
Sharon Lim Pei Siang
Calvin Chua Hung Ming
Surya Bhattacharya
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Copper wire bond reliability evaluation using a modular test chip
2012
EPTC | Electronics Packaging Technology Conference
Alastair David Trigg
Chai Tai Chong
Sheryl Yong Puay Fen
Jasmond Lee Thiam Kwee
Calvin Chua Hung Ming
Sharon Chan Sok Mung
Chen Ping
Vetrivel Periasamy Ganesh
Low
Tan Lan Chu
Eu Poh Leng
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Citations (5)
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