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Michael Friedemann
Michael Friedemann
GlobalFoundries
Materials science
Analytical chemistry
Deposition (law)
Physical vapor deposition
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5
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20
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Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films in Cu/low-k interconnects
2013
Microelectronic Engineering
H. Wojcik
Christoph Hossbach
C. Kubasch
Patrick Verdonck
Y Yohan Barbarin
U. Merkel
Johann W. Bartha
René Hübner
Hans-Jürgen Engelmann
Michael Friedemann
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Interface engineering for the TaN/Ta barrier film deposition process to control Ta-crystal growth
2013
Microelectronic Engineering
Lukas Gerlich
S. Ohsiek
Christoph Klein
Mario Geií
Michael Friedemann
Peter Kücher
Dieter SchmeiíEr
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Ultrathin TaN/Ta barrier modifications to fullfill next technology node requirements
2011
IITC | International Interconnect Technology Conference
Lukas Gerlich
S. Ohsiek
Christoph Klein
M. Geiss
Michael Friedemann
Peter Kücher
Dieter Schmeisser
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Investigations on Ru-Mn films as plateable Cu diffusion barriers
2011
IITC | International Interconnect Technology Conference
H. Wojcik
R. Kaltofen
Cornelia Krien
U. Merkel
Christian Wenzel
Johann W. Bartha
Michael Friedemann
Barbara Adolphi
Romy Liske
Volker Neumann
Marion Geidel
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Simulation of TaNx deposition by Reactive PVD
2010
Microelectronic Engineering
H. Wolf
Reinhard Streiter
Michael Friedemann
P. Belsky
O. Bakaeva
T. Letz
Thomas Gessner
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Citations (5)
1