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Masaki Matsubara

Hokkaido University

9

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177

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Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

2017 Scientific Reports
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Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

2017 Journal of Materials Chemistry C
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Surface-Assisted Laser Desorption Ionization Mass Spectrometry (SALDI-MS) of Low-Molecular-Weight Medicines and Toxic Materials Using Commercial TiO2 Nanoparticles

2016 Bulletin of the Chemical Society of Japan
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Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation

2016 RSC Advances
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Effect of Glass Transition Temperature of Stabilizing Polymer of Air-Stable Gelatin-Stabilized Copper Fine Particles during Redox Two-Step Low-Temperature Sintering Process

2015 Bulletin of the Chemical Society of Japan
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The mechanism of alkylamine-stabilized copper fine particles towards improving the electrical conductivity of copper films at low sintering temperature

2015 Journal of Materials Chemistry C
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Low-temperature nanoredox two-step sintering of gelatin nanoskin-stabilized submicrometer-sized copper fine particles for preparing highly conductive layers

2015 RSC Advances
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Silver sputtering into a liquid matrix containing mercaptans: the systematic size control of silver nanoparticles in single nanometer-orders

2015 New Journal of Chemistry
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Proton-assisted low-temperature sintering of Cu fine particles stabilized by a proton-initiating degradable polymer

2015 RSC Advances
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