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Chengwn Wang
Chengwn Wang
Polishing
Substrate (chemistry)
Grinding
Materials science
Metallurgy
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Consideration of high efficient polishing of SiC substrate with grinding process as a pre-process
2017
Noboru Fukiharu
Chengwn Wang
Takaaki Toyama
Syuhei Kurokawa
Terutake Hayasi
Yoji Matsukawa
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