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Binyu Wang
Binyu Wang
Xi'an Jiaotong University
Materials science
Power module
Electronic engineering
MOSFET
Heat spreader
5
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2
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0
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Interleaved Planar Packaging Method of Multichip SiC Power Module for Thermal and Electrical Performance Improvement
2021
IEEE Transactions on Power Electronics
Fengtao Yang
Jia Lixin
Laili Wang
Fan Zhang
Binyu Wang
Cheng Zhao
Jianpeng Wang
Christoph Friedrich Bayer
Jan Abraham Ferreira
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Directly Integrated Vapor Chamber as an Efficient Heat Spreader for High Heat Flux Density SiC MOSFET Dies in Power Modules
2021
ECCE | European Conference on Cognitive Ergonomics
Wei Mu
Binyu Wang
Shenghe Wang
Fengtao Yang
Dingkun Ma
Laili Wang
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Direct Integration of Optimized Phase-change Heat Spreaders into SiC Power Module for Thermal Performance Improvements under High Heat Flux
2021
IEEE Transactions on Power Electronics
Wei Mu
Laili Wang
Binyu Wang
Tongyu Zhang
Fengtao Yang
Hong Zhang
Yongmei Gan
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Design of Packaging Structure in High Voltage Power Modules to Avoid Surface Breakdown
2020
WiPDA | IEEE Workshop on Wide Bandgap Power Devices and Applications
Feifei Yan
Laili Wang
Tao Yang
Binyu Wang
Fengtao Yang
Longyang Yu
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A Lifetime Estimation Method of MMC Submodules based on the Combination of FEA and Physical Lifetime Model
2019
ICPE | International Conference on Performance Engineering
Binyu Wang
Jianpeng Wang
Dingkun Ma
Laili Wang
Fengtao Yang
Xinying Li
Youbo Tan
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Citations (2)
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