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Victoria L. Calero-DdelC
Victoria L. Calero-DdelC
IBM
Silicon
Composite material
Materials science
Electronic engineering
Soldering
3
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3
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0
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Innovative Design of Crackstop Wall for 14nm Technology Node and Beyond
2018
ECTC | Electronic Components and Technology Conference
Mohamed A. Rabie
Nicholas A. Polomoff
Khaled Hassan
Victoria L. Calero-DdelC
Danielle Degraw
Michael Hecker
Michael Thiele
El Mehdi Bazizi
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An effective method for full solder intermetallic compound formation and Kirkendall void control in Sn-base solder micro-joints
2015
ECTC | Electronic Components and Technology Conference
Hongqing Zhang
Eric D. Perfecto
Victoria L. Calero-DdelC
Frank L. Pompeo
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MBIR characterization of Photosensitive Polyimide in high volume manufacturing
2014
ASMC | Advanced Semiconductor Manufacturing Conference
Taher Kagalwala
Brian M. Erwin
Victoria L. Calero-DdelC
Yuri M. Brovman
Jonny Hoglund
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