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Dongsu Ryu

Amkor Technology

6

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33

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High-Performance Flip Chip Bonding Mechanism Study with Laser Assisted Bonding

2020 ECTC | Electronic Components and Technology Conference
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Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4th Industrial Revolution Era

2020 ECTC | Electronic Components and Technology Conference
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Double Side SMT and Molding Process Development for mPossum Package

2016
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Development of large die fine pitch flip chip BGA using TCNCP technology

2012 ECTC | Electronic Components and Technology Conference
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Citations (16)