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E. Lagoutte
E. Lagoutte
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Robustness (computer science)
Die (manufacturing)
Microelectronics
Flow (psychology)
2
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1
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0
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A reliable copper-free wafer level hybrid bonding technology for high-performance medical imaging sensors
2020
ECTC | Electronic Components and Technology Conference
A. Jouve
E. Lagoutte
R. Crochemore
G. Mauguen
T. Flahaut
C. Dubarry
V. Balan
F. Fournel
E. Bourjot
F. Servant
M Scannell
K. Rohracher
T. Bodner
A. Faes
J. Hofrichter
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Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development
2019
DIC | IEEE International D Systems Integration Conference
E. Bourjot
P. Stewart
C. Dubarry
E. Lagoutte
Emmanuel Rolland
N. Bresson
G. Romano
Daniel Scevola
V. Balan
J. Dechamp
Marc Zussy
G. Mauguen
C. Castán
Loïc Sanchez
A Jouve
F. Fournel
S. Cheramy
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