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Arni Kujala

Nokia

5

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Enhancing drop test efficacy for product quality improvement through interconnection shear tests

2006 ECTC | Electronic Components and Technology Conference
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Drop impact life prediction model for lead-free BGA packages and modules

2005 EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
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