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Marika Sorrieul

STMicroelectronics

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CHAPTER 17, Diesigning for Packaging Reliability

2005 International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
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Drop impact life prediction model for lead-free BGA packages and modules

2005 EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
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