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C. Zistl
C. Zistl
Advanced Micro Devices
Electromigration
Electronic engineering
Engineering
test structure
barrier integrity
4
Papers
34
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Extensive investigations of temperature influence on barrier integrity during reliability testing
2008
Microelectronic Engineering
Oliver Aubel
Moritz Andreas Meyer
Frank Feustel
Hans-Jürgen Engelmann
Inka Zienert
J. Poppe
H. Schmidt
D. Gehre
Holm Geisler
Eckhard Langer
P. Limbecker
T. Foltyn
C. Witt
W. Yao
S. Thierbach
Frank Koschinsky
C. Zistl
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Citations (1)
Comprehensive reliability analysis of CoWP Metal Cap unit processes for high volume production in sub-μm dimensions
2008
IRPS | International Reliability Physics Symposium
Oliver Aubel
S. Thierbach
Robert Seidel
Berit Freudenberg
Moritz Andreas Meyer
Frank Feustel
J. Poppe
Markus Nopper
Axel Preusse
C. Zistl
K. Weide-Zaage
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Citations (11)
Investigation of via Bottom Barrier Integrity Impact on Electromigration
2007
IRPS | International Reliability Physics Symposium
Oliver Aubel
S. Thierbach
F. Koschinsky
Frank Feustel
Christine Hau-Riege
C. Zistl
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Citations (7)
Dependence of the minimal PVD TA(N) sealing thickness on the porosity of Zirkon TM LK Dielectric films
2002
Microelectronic Engineering
Francesca Iacopi
C. Zistl
Christiane Jehoul
Zsolt Tokei
Quoc Toan Le
Arabinda Das
C. Sullivan
Greg Prokopowicz
Dana A. Gronbeck
Mike Gallagher
Jeff Calvert
Karen Maex
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Citations (15)
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